Patterned circuitry with foraminous substrate and method of maki

Details Patterned circuitry with foraminous substrate and method of maki Patterned circuitry with foraminous substrate and method of maki

1993-03-18

1994-02-08

Ball, Micahel W.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

156 47, 156243, 264104, 427 96, 428901, H01B 1300

Patent

active

052850153

ABSTRACT:
Patterned electrical circuitry in laminar form with foraminous substrate having been sized with conductive and non-conductive compositions in any desired side-by-side patterned configuration. The resulting lamina is substantially homogeneous electrically through any part of its thickness despite the interposition of fragmentary portions of the foraminous substrate, which may be made up of paper, polymeric film, or textile material.

REFERENCES:
patent: 3350498 (1967-10-01), Leeds
patent: 3704164 (1972-11-01), Travis
patent: 4067945 (1978-01-01), DuRocher
patent: 4103102 (1978-07-01), Klein
patent: 4604160 (1986-08-01), Murakami et al.
patent: 4651417 (1987-03-01), Schumacher, III et al.
patent: 4673904 (1987-06-01), Landis
patent: 4769270 (1988-09-01), Nagamatsu et al.
patent: 4875282 (1989-10-01), Leibowitz
patent: 4912020 (1990-03-01), King et al.

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