Patterned chromium barrier layer with flange-like structure

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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428901, 361751, B32B 900

Patent

active

054159202

ABSTRACT:
A conductive pattern layer structure includes an insulating member containing polyimide, a patterned thin film formed on the insulating member, and a patterned conductive layer formed on the thin film. The patterned conductive layer contains copper. Further, the layer structure includes a patterned barrier layer covering an upper surface and side surfaces of the patterned conductive layer to prevent copper from being diffused into another insulating layer formed around the patterned barrier layer.

REFERENCES:
patent: 4411972 (1983-10-01), Narken et al.
patent: 4720442 (1988-01-01), Shinkai et al.
patent: 4770897 (1988-09-01), Wu
patent: 4810332 (1989-03-01), Pan
IBM Technical Disclosure Bulletin vol. 20, No. 1, Jun. 1977, New York U.S. pp. 77-78 R. E. Ruane "Applicaiton of Immersion Tin as an Etch Mask to Printed-Circuit Lines".

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