Patterned array of uniform metal microbeads

Metal fusion bonding – Process – Preplacing solid filler

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228 563, 427123, 427375, 4273831, 156241, B23K 3500, B23K 3514

Patent

active

053661400

ABSTRACT:
The present invention provides a method for providing an array of metal microbeads on a substrate, preferably in a regular pattern of very fine, uniform size microspheres or microbeads at precise spacing or scale previously unachievable. The method of the present invention comprises the steps of providing a metal layer on a substrate that is partitioned into metal regions; heating the metal layer to a temperature sufficient to melt the metal and to permit beading of the layer into discrete microbeads.

REFERENCES:
patent: 2822509 (1953-05-01), Harvey
patent: 4000334 (1976-10-01), Hallman et al.
patent: 4097266 (1978-06-01), Takahashi et al.
patent: 4242439 (1980-12-01), Izu et al.
patent: 4267261 (1981-05-01), Hallman et al.
patent: 4606962 (1986-08-01), Reylek
patent: 4814040 (1989-03-01), Ozawa
patent: 5026599 (1991-06-01), Koskenmaki
patent: 5120678 (1992-06-01), Moore et al.
patent: 5185178 (1993-02-01), Koskenmaki

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