Metal fusion bonding – Process – Preplacing solid filler
Patent
1993-09-30
1994-11-22
Heinrich, Samuel M.
Metal fusion bonding
Process
Preplacing solid filler
228 563, 427123, 427375, 4273831, 156241, B23K 3500, B23K 3514
Patent
active
053661400
ABSTRACT:
The present invention provides a method for providing an array of metal microbeads on a substrate, preferably in a regular pattern of very fine, uniform size microspheres or microbeads at precise spacing or scale previously unachievable. The method of the present invention comprises the steps of providing a metal layer on a substrate that is partitioned into metal regions; heating the metal layer to a temperature sufficient to melt the metal and to permit beading of the layer into discrete microbeads.
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Calhoun Clyde D.
Koskenmaki David C.
Griswold Gary L.
Gwin, Jr. H. Sanders
Heinrich Samuel M.
Kirn Walter N.
Minnesota Mining and Manufacturing Company
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