Patternable particle filled adhesive matrix for forming patterne

Details Patternable particle filled adhesive matrix for forming patterne Patternable particle filled adhesive matrix for forming patterne

1994-10-07

1997-09-23

Davis, Jenna

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

428328, 428330, 428331, 428356, B32B 516

Patent

active

056702515

ABSTRACT:
A patternable bonding material for joining the surfaces of two or more substrates permits localization of conductive or insulating hard-cored particles within an adhesive matrix to form patterned structures on or between the surfaces. Electrical, thermal, or mechanical energy may be transferred through, or isolated by the material. The material may be used in an uncured state to allow easy separation of the joined surfaces, or a more permanent bond may be formed. The adhesive may be cured by thermocuring, evaporation or ablation of organic components, pressure, or by the application of ultraviolet radiation.

REFERENCES:
patent: 3100933 (1963-08-01), Hancock
patent: 3203083 (1965-08-01), Obenhaus
patent: 3482726 (1969-12-01), Schroeder
patent: 3555664 (1971-01-01), Bingham
patent: 3632319 (1972-01-01), Hoppin

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