Pattern transfer apparatus

Details Pattern transfer apparatus Pattern transfer apparatus

1986-12-17

1988-01-19

Hayes, Monroe H.

Photocopying

Projection printing and copying cameras

With temperature or foreign particle control

355 53, G03B 2752

Patent

active

047207329

ABSTRACT:
A pattern transfer apparatus for transferring a pattern of a mask onto a wafer. The apparatus includes a wafer chuck for holding the wafer at a position whereat the pattern of the mask is transferred onto the wafer. The temperature of the wafer held by the wafer chuck is controlled to expand/contract the wafer to achieve alignment of the pattern of the mask with a pattern which has already been formed on the wafer. A mechanism for preparatively adjusting the temperature of the wafer before it is moved to the wafer chuck is provided, whereby the time until the temperature of the wafer on the wafer chuck reaches a desired level is reduced and, therefore, throughput of the apparatus is improved. Further, any fluctuation in the temperature of the wafer chuck is prevented so that the reliability of alignment between the pattern of the mask and the pattern formed on the wafer is improved.

REFERENCES:
patent: 3865254 (1975-02-01), Johannsmeier
patent: 4202623 (1980-03-01), Watkin
patent: 4256829 (1981-03-01), Daniel
patent: 4432635 (1984-02-01), Mayer
patent: 4503335 (1985-05-01), Takahashi

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