Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2008-04-29
2008-04-29
Desire, Gregory M (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C348S087000, C356S237200, C382S144000, C382S218000, C716S030000
Reexamination Certificate
active
10781101
ABSTRACT:
A pattern inspection method and a pattern inspection apparatus, which has an improved precision in detecting and correcting the positional deviation of images for a die comparison, have been disclosed. The quantity of correction of positional deviation of the images for the die comparison is determined based on the positional information of the images at multiple separate places in a die (pattern). For example, the multiple separate places include the vicinities of both ends in the pattern arrangement to be scanned in the die, and the part where the inspection is not completed yet. When the positional information of the part where the inspection is not completed yet is used, the correction of the positional relation of the images to be compared and the comparison of the images are started immediately after the capture of the images of two patterns is completed.
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Christie Parker & Hale LLP
Desire Gregory M
Tokyo Seimitsu Co. Ltd.
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