Pattern forming method, device, method of manufacture...

Details Pattern forming method, device, method of manufacture... Pattern forming method, device, method of manufacture...

2007-04-03

2007-04-03

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

C257SE21001

Reexamination Certificate

active

10849001

ABSTRACT:
A method of forming a predetermined pattern by disposing a functional liquid on a substrate, the method includes the steps of forming banks on the substrate, and disposing the functional liquid on a region divided by the banks, wherein a width of the region is partially formed so as to be large.

REFERENCES:
patent: 6179400 (2001-01-01), Akahira et al.
patent: 6524876 (2003-02-01), Baek et al.
patent: 6593591 (2003-07-01), Yudasaka et al.
patent: 6610552 (2003-08-01), Fujimori et al.
patent: 6713389 (2004-03-01), Speakman
patent: 6734029 (2004-05-01), Furusawa
patent: 7008809 (2006-03-01), Hasei
patent: 7037812 (2006-05-01), Kawahara et al.
patent: 2004/0201048 (2004-10-01), Seki et al.
patent: 2006/0035064 (2006-02-01), Hirai
patent: A 05-061069 (1993-03-01), None
patent: A 05-259300 (1993-10-01), None
patent: A 05-326728 (1993-12-01), None
patent: A 08-327816 (1996-12-01), None
patent: A 11-274671 (1999-10-01), None
patent: A 2000-216330 (2000-08-01), None
patent: A 2002-164635 (2002-06-01), None
patent: A 2002-261048 (2002-09-01), None
patent: A 202-343953 (2002-11-01), None
patent: A 2002-343953 (2002-11-01), None
patent: 2003317945 (2003-11-01), None
patent: A 2001-0009269 (2001-02-01), None

Affiliated with

Also associated with

Rating

Pattern forming method, device, method of manufacture... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pattern forming method, device, method of manufacture..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pattern forming method, device, method of manufacture... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3733496