Pattern forming method and pattern forming system

Details Pattern forming method and pattern forming system Pattern forming method and pattern forming system

2007-01-24

2010-06-29

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

C438S017000, C438S748000, C264S040500, C264S220000, C264S408000, C257SE21504, C257SE21595, C257SE23179

Reexamination Certificate

active

07745237

ABSTRACT:
Method of forming a pattern by a nanoimprint technique starts with preparing a mold with nanostructures on its surface. The mold is pressed against a substrate or plate coated with a resin film. The positions of alignment marks formed on the rear surface of the plate coated with the resin film are detected. Thus, a relative alignment between the mold and the plate coated with the resin film is performed.

REFERENCES:
patent: 5259926 (1993-11-01), Kuwabara et al.
patent: 5408320 (1995-04-01), Katagiri et al.
patent: 5772905 (1998-06-01), Chou
patent: 6790870 (2004-09-01), Desimone et al.
patent: 2004/0141163 (2004-07-01), Bailey et al.
patent: 2004/0142575 (2004-07-01), Brewer
patent: 2005/0023145 (2005-02-01), Cohen et al.
patent: 2006/0127522 (2006-06-01), Chou
patent: 0 794 016 (1997-09-01), None
48.4: One Micron Precision Optically Aligned Method for Hot-Embossing and Nanoimprinting, Islam, R. et al, Proceedings of the IEEE Sensors 2002, Orlando, FL. Jun. 12-14, 2002, IEEE International Conference on Sensors, New York, NY vol. 1 of 2 Conf. 1 Jun. 12, 2002 pp. 931-935.

Affiliated with

Also associated with

Rating

Pattern forming method and pattern forming system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pattern forming method and pattern forming system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pattern forming method and pattern forming system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4232637