Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...
Reexamination Certificate
2007-10-16
2007-10-16
Fletcher, III, William Phillip (Department: 1762)
Coating processes
Direct application of electrical, magnetic, wave, or...
Polymerization of coating utilizing direct application of...
C427S517000, C427S272000, C430S422000, C430S269000
Reexamination Certificate
active
11295553
ABSTRACT:
The present invention has as its object to provide a pattern forming method which, even if a pattern is formed by photolithography, can keep the edge of the opening portion of the pattern in a sharp state and yet, can make the wall surface of the recess of the pattern into a tapered shape, and a method of manufacturing an ink jet recording head to which the aforedescribed method is applied. The pattern forming method is a pattern forming method having the step of forming on a substrate a coat resin layer containing a photopolymerizable resin, the step of applying a solution containing a photopolymerization starting agent onto the coat resin layer, and forming the distribution of the density of the photopolymerization starting agent in the direction of film thickness of the coat resin layer, and the step of applying light from above the coat resin layer through a mask having a pattern depicted thereon, and the step of developing the coat resin layer to which the light has been applied to thereby make it into a coat resin layer having the pattern, and this method is applied to the manufacture of an ink jet recording head.
REFERENCES:
patent: 5730889 (1998-03-01), Miyagawa et al.
patent: 6139761 (2000-10-01), Ohkuma
patent: 6305080 (2001-10-01), Komuro et al.
patent: 6455112 (2002-09-01), Ohkuma et al.
patent: 6530641 (2003-03-01), Ohashi et al.
patent: 6766579 (2004-07-01), Ohkuma
patent: 6895668 (2005-05-01), Imamura
patent: 7008552 (2006-03-01), Ohkuma
patent: 2006/0125884 (2006-06-01), Sato et al.
patent: 2006/0132539 (2006-06-01), Hino et al.
patent: 2006/0221133 (2006-10-01), Harada et al.
patent: 2006/0230614 (2006-10-01), Imamura et al.
patent: 2006/0277755 (2006-12-01), Kubota et al.
patent: 2007/0017894 (2007-01-01), Murayama et al.
patent: 6-286149 (1994-10-01), None
Hatta Maki
Ohkuma Norio
Ohsumi Masaki
Ono Takayuki
Ueda Hikaru
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Fletcher, III William Phillip
LandOfFree
Pattern forming method and method of manufacturing ink jet... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Pattern forming method and method of manufacturing ink jet..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pattern forming method and method of manufacturing ink jet... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3876694