Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2005-09-06
2005-09-06
Mehta, Bhavesh M. (Department: 2625)
Image analysis
Applications
Manufacturing or product inspection
C250S492200, C430S022000, C430S296000
Reexamination Certificate
active
06941008
ABSTRACT:
To achieve down-sizing and improvements of throughputs, light exposure and charge beam exposure are sometimes used together. In case of performing exposure of a desired pattern in a plurality of stages, a positional displacement of each of exposure patterns in the stages leads to a decrease in exposure accuracy. According to the present invention, in case of forming a fine pattern by exposure after exposure of a rough pattern, the exposure position of the rough pattern is adjusted, based on a latent image of the rough pattern which has been subjected to exposure. As a result, a positional-displacement between rough and fine patterns is reduced so that a desired pattern can be formed with high accuracy.
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Ando Atsushi
Nakasugi Tetsuro
Okumura Katsuya
Sugihara Kazuyoshi
Chawan Sheela
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Mehta Bhavesh M.
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