Pattern fabrication method using a charged particle beam and app

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

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250398, H01J 37304

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active

052784215

ABSTRACT:
The present application relates to a method and an apparatus for forming a pattern, in which a plane on which a pattern on a sample is traced is decomposed into predetermined partial regions; the pattern density in each of the partial regions is stored in data storing means as pattern density map data; and the irradiation energy amount of a charged particle beam is corrected on the basis of the pattern density map data to correct shortage and excess in the exposure dose due to roughness and fineness of the pattern, i.e. the proximity effect. Further, the present application relates to a method and an apparatus for forming a pattern, in which, when one or a plurality of layers located under the layer on which the pattern should be formed have patterns, influences of the underlayers on the proximity effect are taken into account.

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patent: 5149975 (1992-09-01), Yoda et al.
H. C. Pfeiffer, "Variable Spot Shaping for Electron-Beam Lithography", J. Vac. Sci. Technol., vol. 15, No. 3, May/Jun. 1978, pp. 887-890.
G. Owen et al., "Proximity Effect Correction for Electron Beam Lithography by Equalization of Background Dose", J. Vac. Sci. Technol., vol. 54, No. 6, Jun. 1983, pp. 3573-3581.
M. E. Haslam et al., "Two-Dimensional Haar Thinning for Data Base Compaction in Fourier Proximity Correction for Electron Beam Lithography", J. Vac. Sci. Technol. B., vol. 3, No. 1, Jan./Feb. 1985, pp. 165-173.
T. Abe et al., "Proximity Effect Correction for an Electron Beam Direct Writing System EX-7", J. Vac. Sci. Technol. B, vol. 7, No. 6, Nov./Dec. 1989, pp. 1524-1527.

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