Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2007-08-29
2011-10-18
Tabatabai, Abolfazl (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C332S102000, C329S305000
Reexamination Certificate
active
08041105
ABSTRACT:
A pattern evaluation method includes: acquiring a plurality of examination images obtained in regard to an evaluation target pattern, at least one of the plurality of examination images being different from the other examination images; detecting all edges of the evaluation target pattern in each of the examination images; executing alignment of the evaluation target pattern in the respective examination images with a sub-pixel accuracy based on the detected edges; superimposing the aligned pattern edges to generate a single combined edge; measuring the combined edge; and evaluating the evaluation target pattern based on a result of the measurement.
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Notification of Reasons for Rejection issued by the Japanese Patent Office in Japanese Patent Application No. 2006-234052, mailed Jul. 21, 2009.
Notification of Reasons for Rejection issued by the Japanese Patent Office in Japanese Patent Application No. 2006-234052, mailed Jan. 30, 2009.
Decision of Final Rejection issued by the Japanese Patent Office on Oct. 27, 2009, for Japanese Patent Application No. 2006-234052, and English-language translation thereof.
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
Tabatabai Abolfazl
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