Surgery: splint – brace – or bandage – Bandage structure – Skin laceration or wound cover
Reexamination Certificate
2005-02-15
2005-02-15
Lewis, Kim M. (Department: 3743)
Surgery: splint, brace, or bandage
Bandage structure
Skin laceration or wound cover
C602S054000, C206S440000, C206S441000
Reexamination Certificate
active
06855861
ABSTRACT:
A patch with a fast-opening package comprises an adhesive support, possibly lacking the bandage pad and covered by one or more films of a protective material that can be separated from the adhesive support, a wrapper enclosing the patch and consisting of two half-wrappers that can be separated by pulling two end portions, at least one of the two half-wrappers being anchored to the one or more films protective material. At least one film of protective material has an extension that covers at least half the support and has a region submitted to die pressing to reduce the surface in contact with the adhesive, thereby allowing removal of the film by pulling the associated half-wrapper without a noticeable effort.
REFERENCES:
patent: 3245855 (1966-04-01), Stenvall
patent: 3630201 (1971-12-01), Endres
patent: 4235337 (1980-11-01), Dotta
patent: 4265234 (1981-05-01), Schaar
patent: 4781293 (1988-11-01), Johns
patent: 4806300 (1989-02-01), Walton et al.
patent: 5115913 (1992-05-01), Anhauser et al.
patent: 5188124 (1993-02-01), Feret
patent: 5333753 (1994-08-01), Etheredge
patent: 5397297 (1995-03-01), Hunter
patent: 5505306 (1996-04-01), Akemi et al.
patent: 5722943 (1998-03-01), Sessions
patent: 0 635 262 (1995-01-01), None
patent: 0 810 078 (1997-12-01), None
Katten Muchin Zavis & Rosenman
Lewis Kim M.
LandOfFree
Patch with a fast-opening package, and method of and device... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Patch with a fast-opening package, and method of and device..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Patch with a fast-opening package, and method of and device... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3504108