Pastes for improved substrate dimensional control

Details Pastes for improved substrate dimensional control Pastes for improved substrate dimensional control

1998-02-09

2000-09-12

Graybill, David E.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252515, H01B 102, H01C 102

Patent

active

061173673

ABSTRACT:
Metal pastes used in the fabrication of multilayer ceramic (MLC) substrates used in semiconductor devices. The pastes reduce substrate defects, such as via bulge and camber. The pastes are comprised of a metal having high conductivity, frit which includes glass, an organic binder, and a solvent, optionally with a surfactant.

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