Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – Including wiper
Reexamination Certificate
2007-03-12
2010-10-26
Kerns, Kevin P (Department: 1793)
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
Including wiper
C118S120000, C118S304000, C118S413000
Reexamination Certificate
active
07819300
ABSTRACT:
In a flux transfer unit to be used in an electronic component mounting apparatus for transferring flux to an electronic component picked up from a component feed unit and then mounting the electronic component onto a board, a blade holding head which has a first blade and a second blade for film formation use and scraping use of flux, respectively, and which is reciprocatively driven by a rodless cylinder via a drive transmission pin, is held by a movable member so as to be swingable about a swing support pin, and the movable member is braked with a specified braking force by a plate spring member. Thus, each time the direction of motion of the blade is reversed, the blade holding head swings, so that the first blade and the second blade can be automatically switched over without providing any exclusive drive mechanism.
REFERENCES:
patent: 6581282 (2003-06-01), Mori et al.
patent: 2000-022394 (2000-01-01), None
patent: 2000-188498 (2000-07-01), None
patent: 2003-023036 (2003-01-01), None
patent: 2004-330261 (2004-11-01), None
patent: 2004/100629 (2004-11-01), None
International Preliminary Report on Patentability and Written Opinion of the International Searching Authority, issued Sep. 16, 2008 in the International (PCT) Application of which the present application is the U.S. National Stage.
International Search Report issued Apr. 17, 2007 in the International (PCT) Application of which the present application is the U.S. National Stage.
Furuta Noboru
Inaba Yuzuru
Kabeshita Akira
D'Aniello Nicholas P
Kerns Kevin P
Panasonic Corporation
Wenderoth Lind & Ponack, LLP.
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