Paste solder with minimized residue

Details Paste solder with minimized residue Paste solder with minimized residue

1991-12-13

1993-01-05

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 23, 148 25, B23K 3534

Patent

active

051767597

ABSTRACT:
A paste solder with minimized flux residue remaining after soldering comprises a powdered solder and a flux in admixture. The flux comprises from about 5% to about 40% by weight of carrier components which comprise a rosin or a rosin derivative, an activating agent, and a thixotropic agent and from about 60% to about 95% by weight of a solvent which predominantly comprises a 2-alkyl-1,3-hexanediol having 1 to 4 carbon atoms in the alkyl group.

REFERENCES:
patent: 4759490 (1988-07-01), Ochiai

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