Paste for soldering and soldering method using the same

Details Paste for soldering and soldering method using the same Paste for soldering and soldering method using the same

2005-10-27

2011-12-27

Ward, Jessica L (Department: 1735)

Metal fusion bonding

Process

Using high frequency vibratory energy

C228S208000, C228S262450, C228S214000, C228S256000, C228S215000, C228S207000, C438S612000

Reexamination Certificate

active

08083121

ABSTRACT:
In the soldering method, metal-powder-contained flux is disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprising a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.

REFERENCES:
patent: 5837119 (1998-11-01), Kang et al.
patent: 6189771 (2001-02-01), Maeda et al.
patent: 6680128 (2004-01-01), Mei
patent: 6951666 (2005-10-01), Kodas et al.
patent: 2002/0185309 (2002-12-01), Imamura et al.
patent: 2003/0121564 (2003-07-01), Taguchi et al.
patent: 2004/0026484 (2004-02-01), Yamashita et al.
patent: 2004/0177997 (2004-09-01), Hata et al.
patent: 2000-031210 (2000-01-01), None
patent: 2002-314241 (2002-10-01), None
patent: 2003264259 (2003-09-01), None
patent: 2004-274000 (2004-09-01), None
patent: WO 2005/072906 (2005-08-01), None
JP 2003264259 A english computer translation.
European Search Report issued in European Patent Application No. EP 05805313.13-1215/1808265 PCT/JP2005019749, dated Sep. 18, 2009.

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