Paste for forming thick film, method for manufacturing...

Details Paste for forming thick film, method for manufacturing... Paste for forming thick film, method for manufacturing...

2005-02-01

2005-02-01

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C252S510000, C252S511000, C210S499000, C210S500330, C210S505000, C210S336000, C210S356000

Reexamination Certificate

active

06849206

ABSTRACT:
A method for manufacturing a paste for forming a thick film is provided, in which undesired lump materials are efficiently removed from the paste for forming the thick film. The paste, which contains a solid material and an organic vehicle and has a viscosity in the range of about 1 to 50 Pa·s, is filtrated with a sintered metal type filter manufactured by integrally sintering a nonwoven fabric filter part, having a thickness of many folded linear metal fibers and having a mesh opening size of about 1 to 20 μm, and a wire gauze part composed of metal wires knitted into the shape of a mesh.

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