Paste for forming an interconnect and interconnect formed...

Details Paste for forming an interconnect and interconnect formed... Paste for forming an interconnect and interconnect formed...

2008-02-27

2011-12-27

Wyszomierski, George (Department: 1733)

Specialized metallurgical processes, compositions for use therei

Compositions

Loose particulate mixture containing metal particles

C420S560000

Reexamination Certificate

active

08083832

ABSTRACT:
A composite paste for forming interconnects that includes a quantity of metallic binder particles, a quantity of metallic filler particles, and a quantity of flux, where the binder particles comprise no more than 94.5% of the total weight of the quantity of the composite paste, and the total weight of the filler particles and the flux comprise the balance of the total weight of the quantity of the composite paste, where the flux is no more than 10% of the total weight of the flux and the filler particles.

REFERENCES:
patent: 6624522 (2003-09-01), Standing et al.
patent: 2004/0119148 (2004-06-01), Standing
patent: 2005/0093164 (2005-05-01), Standing
patent: 2006/0021466 (2006-02-01), Goudarzi et al.

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