Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-09-06
2005-09-06
Robertson, Jeffrey B. (Department: 1712)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S155000, C523S201000, C523S434000, C523S436000, C523S437000, C525S107000, C525S108000, C525S109000, C525S113000, C528S106000
Reexamination Certificate
active
06939431
ABSTRACT:
Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.
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Ikesugi Daisuke
Kira Takatoshi
Mizuta Yasushi
Murata Tatsuji
Nakahara Makoto
Burns Doane , Swecker, Mathis LLP
Mitsui Chemicals Inc.
Robertson Jeffrey B.
Sharp Corporation
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