Paste composition for the production of electrically conductive

Details Paste composition for the production of electrically conductive Paste composition for the production of electrically conductive

1980-09-22

1983-07-05

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

252513, 252514, 252518, 106 113, 106 114, 106 115, 106 118, 106 119, 106 121, 524401, 524420, 524423, 524435, 524439, 524440, H01B l06, H01B 102

Patent

active

043917429

ABSTRACT:
Paste composition for producing an electrically conductive and solderable structure along with the resulting article are disclosed. Metal particles, metal salts and an organic polymer binder are formed into a paste which is applied to a non-conductive substrate by printing or the like. The paste is heated to permit metal salts to migrate to the surface of the binder where they become concentrated. During metallizing the salts are removed by the bath and metal is deposited in pores formed in the binder by the dissolved salts. The metal layer is adherent to the binder and provides good solderable points.

REFERENCES:
patent: 4009093 (1977-02-01), Luch
patent: 4051454 (1977-09-01), Leiser et al.
patent: 4127699 (1978-11-01), Aumiller et al.
patent: 4170677 (1979-10-01), Hutcheson

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