Passively cooled PC heat stack having a heat-conductive structur

Details Passively cooled PC heat stack having a heat-conductive structur Passively cooled PC heat stack having a heat-conductive structur

1996-02-07

1997-09-23

Phillips, Michael W.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361699, 165 46, G06F 120, H05K 720

Patent

active

056711204

ABSTRACT:
A computer structured with a motherboard has ICs mounted on one side of the motherboard and connections for ports and peripheral devices on the opposite side. The motherboard is mounted to a heat sink plate with heat-conductive structure compressed between the ICs mounted to the motherboard and the heat sink plate, so heat generated by the ICs is conducted into the heat sink plate. The heat sink plate forms one wall of an enclosure for the computer, and as an external wall, radiates heat from the ICs into the surroundings. A riser card with expansion slots is connected to the motherboard in a manner that expansion cards may be mounted to expansion ports either at the front or the rear of the enclosure. The enclosure is adapted to stand with the heat sink plate vertical to take advantage of convection as well as radiation cooling, and in some embodiments the outside surface of the heat sink plate is grooved or channeled to increase the area for radiation, and to aid convection flow.

REFERENCES:
patent: 5138523 (1992-08-01), Benck et al.
patent: 5237486 (1993-08-01), LaPointe et al.
patent: 5313362 (1994-05-01), Hatada et al.
patent: 5316491 (1994-05-01), Satou et al.
patent: 5331506 (1994-07-01), Nakajima
patent: 5424913 (1995-06-01), Swindler

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