Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent
1997-05-15
1998-06-23
Niebling, John
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
438107, 438127, H01L 2144
Patent
active
057704767
ABSTRACT:
An interposer including a first face and a second face opposite the first face and at least one electrically conductive plane. The at least one electrically conductive plane functions as a power, ground, or signal plane. At least one electrically insulating plane is positioned on opposite sides of the at least one electrically conductive plane. A plurality of plated through holes are formed through the at least one electrically conductive planes and the at least two electrically insulating planes. The through holes are selectively electrically joined to the at least one electrically conductive plane. At least one passive electronic structure is positioned within the interposer structure.
REFERENCES:
patent: 4349862 (1982-09-01), Bajorek et al.
patent: 4744008 (1988-05-01), Black et al.
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 5101323 (1992-03-01), Prevost
patent: 5177594 (1993-01-01), Chance et al.
patent: 5258648 (1993-11-01), Lin
patent: 5272600 (1993-12-01), Carey
patent: 5404044 (1995-04-01), Booth et al.
patent: 5468681 (1995-11-01), Pasch
International Business Machines - Corporation
Lebentritt Michael S.
Niebling John
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