Passive intermodulation products (PIM) free tape

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer

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428354, 428922, C09V 702

Patent

active

054947553

ABSTRACT:
The present invention relates to a tape for seaming together RF shielding thermal blankets of the kind used for covering the metal components of high power RF transmit and receive communications systems which are susceptible to generating passive intermodulation products, such as the high power transmit antenna boom assemblies of communications spacecraft. The tape is constructed as a composite lay-up of materials which preferably include a plastic film top or outboard layer, a metallized plastic film or metal foil middle layer, and a transfer adhesive bottom layer for securing the middle layer to the outboard layer. The transfer adhesive functions both as a substrate attaching medium and as an electrical isolator for encapsulating the metal surfaces of the middle layer. The tape, when applied to cover a seam between adjacent RF shielding thermal blankets, prevents RF energy from penetrating the seam and contacting any metal-to-metal junctions underneath which could result in the generation of undesirable passive intermodulation products or "PIM".

REFERENCES:
patent: 4596897 (1986-06-01), Gruhn
patent: 4699830 (1987-10-01), White
patent: 4727221 (1988-02-01), Saitou et al.
patent: 4823229 (1989-04-01), Waterland, III
patent: 4981544 (1991-01-01), Nordale
patent: 4988550 (1992-01-01), Keyser et al.
patent: 5111354 (1992-05-01), Marzi et al.
patent: 5126985 (1992-06-01), Forrest et al.

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