Passive cooling in response to ambient environmental properties

Details Passive cooling in response to ambient environmental properties Passive cooling in response to ambient environmental properties

2008-10-10

2011-10-04

Nguyen, Dinh (Department: 3752)

Heat exchange

With retainer for removable article

Electrical component

C165S287000, C239S013000, C239S075000, C239S551000, C239S566000, C239S571000

Reexamination Certificate

active

08028743

ABSTRACT:
A system for passively cooling an electronic component includes a conduit configured to carry a pressurized cooling fluid. The conduit has a plurality of delivery orifices configured to dispense the pressurized cooling fluid from the conduit to cool the electronic component. Each delivery orifice has a hydrogel mechanism associated therewith, which is configured to individually control each of the plurality of delivery orifices to automatically regulate flow of the cooling fluid in response to a variation in a property of an ambient environment surrounding the hydrogel mechanism. The property of the ambient environment is influenced by an operation of the electronic component.

REFERENCES:
patent: 4350271 (1982-09-01), Eckenhoff
patent: 5498255 (1996-03-01), Wong
patent: 5740970 (1998-04-01), Edwards
patent: 5997527 (1999-12-01), Gumucio et al.
patent: 6682522 (2004-01-01), Carr et al.

Affiliated with

Also associated with

Rating

Passive cooling in response to ambient environmental properties does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Passive cooling in response to ambient environmental properties, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Passive cooling in response to ambient environmental properties will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4261045