Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent
1998-02-11
1999-07-13
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
257774, 257533, H01L 2900, H01L 2348, H01L 2352
Patent
active
059230770
ABSTRACT:
A passive component integrated circuit chip formed on an insulative substrate includes a first conductive metallic layer on a major surface of the substrate; a layer of dielectric material on top of the first conductive metallic layer; a second conductive metallic layer on top of the formation of dielectric material; a layer of insulative material on top of the layer of dielectric material and on and around the second conductive metallic layer, but not completely covering the second conductive metallic layer; a conductive via in contact with a portion of the second conductive metallic layer left uncovered by the layer of insulative material; a resistive layer on top of the layer of insulative material and in contact with the conductive via; a conductive contact in contact with the resistive layer; and a passivation layer on top of the resistive layer so as to provide a seal between the resistive layer and the conductive contact. Conductive end terminations are advantageously formed on the ends of the substrate to terminate selected conductive contacts and/or conductive metallic layers.
REFERENCES:
patent: 4302736 (1981-11-01), Kasanami et al.
patent: 4573101 (1986-02-01), Takeno
patent: 4616290 (1986-10-01), Watanabe et al.
patent: 4665465 (1987-05-01), Tanabe
patent: 4746557 (1988-05-01), Sakamoto et al.
patent: 4904967 (1990-02-01), Morii et al.
patent: 4947286 (1990-08-01), Kaneko et al.
patent: 4999595 (1991-03-01), Azumi et al.
patent: 5034709 (1991-07-01), Azumi et al.
patent: 5075650 (1991-12-01), Okamura et al.
patent: 5173670 (1992-12-01), Naito et al.
patent: 5197170 (1993-03-01), Senda et al.
patent: 5357227 (1994-10-01), Tonegawa et al.
patent: 5367431 (1994-11-01), Kunishi et al.
patent: 5404118 (1995-04-01), Okamura et al.
patent: 5412357 (1995-05-01), Nakamura et al.
patent: 5530411 (1996-06-01), Nakata et al.
patent: 5757067 (1998-05-01), Kambara
Chase John R.
Jeppesen Bruce Leon
Bourns Inc.
Clark Jhihan B.
Saadat Mahshid
LandOfFree
Passive component integrated circuit chip does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Passive component integrated circuit chip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Passive component integrated circuit chip will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2278123