Passive component and electronic component module

Details Passive component and electronic component module Passive component and electronic component module

2007-08-29

2011-11-22

Semenenko, Yuriy (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S260000

Reexamination Certificate

active

08064211

ABSTRACT:
An electronic component module is configured by a passive component mounted on a built-in IC substrate. The passive component is provided with a passive element inductor, and a mounting surface for mounting on a substrate. Concavities are respectively provided at parts of two opposed borders in the mounting surface, and a terminal electrode is provided at the bottom part of the concavities. Since the passive component has a concavity within the mounting surface and the terminal electrode is incorporated within this concavity, the passive component can be mounted low on the substrate surface. Since the terminal electrode is incorporated in the concavity, solder is prevented from spreading fillet-like at the periphery of the inductor, thus increasing the mounting density of the passive component. There is increased freedom for mounting the passive component because the passive component is mounted on the built-in IC substrate in which the IC is embedded in the substrate.

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