Passivation of photonic integrated circuits (PICs)

Details Passivation of photonic integrated circuits (PICs) Passivation of photonic integrated circuits (PICs)

2006-07-11

2006-07-11

Ullah, Akm Enayet (Department: 2874)

Optical waveguides

Integrated optical circuit

C385S129000, C385S131000, C438S038000

Reexamination Certificate

active

07076126

ABSTRACT:
A photonic integrated circuit (PIC) comprises a plurality of integrated optically coupled components formed in a surface of the PIC and a passivating layer overlies at least a portion of the PIC surface. The overlying passivating layer comprises a material selected from the group consisting of BCB, ZnS and ZnSe. Also, when the circuits are PIC chips are die in the semiconductor wafer, a plurality of linear cleave streets are formed in a wafer passivation layer where a pattern of the cleave streets define separate PIC chips in the wafer for their subsequent singulation from the wafer.

REFERENCES:
patent: 4354198 (1982-10-01), Hodgson et al.
patent: 4789642 (1988-12-01), Lorenzo et al.
patent: 4828935 (1989-05-01), Jonker et al.
patent: 4935384 (1990-06-01), Wanlass
patent: 5530580 (1996-06-01), Thompson et al.
patent: 5550666 (1996-08-01), Zirngibl
patent: 5572539 (1996-11-01), Kondo
patent: 5665637 (1997-09-01), Chand
patent: 5930438 (1999-07-01), Palmskog et al.
patent: 6087725 (2000-07-01), Yoshii et al.
patent: 6137939 (2000-10-01), Henry et al.
patent: 6400855 (2002-06-01), Li et al.
patent: 6473541 (2002-10-01), Ho
patent: 6490395 (2002-12-01), Nara et al.
patent: 6701090 (2004-03-01), Hatayama et al.
patent: 6826333 (2004-11-01), Catchmark et al.
patent: 2002/0060316 (2002-05-01), Matsuyama
patent: 2002/0110308 (2002-08-01), Kunkee et al.
patent: 2002/0181871 (2002-12-01), Saito et al.
patent: 2002/0197016 (2002-12-01), Chandrasekhar et al.
patent: 2001094513 (2001-11-01), None
S Ménézo et al., “10-Wavelength 200-GHz Channel Spacing Emitter Integrating DBR Lasers with a PHASAR on InP for WDM Applications”,IEEE Photonics Technology Letters, vol. 11(7), pp. 785-787, Jul. 1999.
J. H. den Besten et al., “Low-Loss, Compact, and Polarization Independent PHASAR Demultiplexer Fabricated by Using a Double-Etch Process”,IEEE Photonics Technology Letters, vol. 14(1), pp. 62-64, Jan. 2002.
Philip Garrou, “GaAs IC Makers Lead the Way in Metals and Low-k Dielectrics”,Compound Semiconductor, pp. 57-59, Jul. 2002.

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