Passivation of metallic equipment surfaces in electroless copper

Details Passivation of metallic equipment surfaces in electroless copper Passivation of metallic equipment surfaces in electroless copper

1982-02-01

1983-07-05

Smith, John D.

Coating processes

Measuring, testing, or indicating

Thickness or uniformity of thickness determined

118 70, 204147, 204196, 427 98, 427437, 4274431, C23C 302

Patent

active

043918417

ABSTRACT:
The metallic surfaces of plating equipment in use during electroless copper deposition, such as vessels, racks supporting substrates being plated, plumbing, and the like are rendered substantially resistant to electroless copper deposition for extended periods by initially imposing on such equipment surfaces an electrical potential more positive than the mixed potential of the electroless copper solution and sufficiently positive to resist electroless deposition, electrolessly depositing copper on the substrate being plated, and while depositing such copper maintaining on the equipment surface a potential sufficiently positive to resist the formation of adherent electroless copper deposits.

REFERENCES:
patent: 2921005 (1960-01-01), Bodamer
patent: 3208925 (1965-09-01), Hutchison et al.
patent: 3347768 (1967-10-01), Clark et al.
patent: 3424660 (1969-01-01), Klein
patent: 3437572 (1969-04-01), Banks et al.
patent: 3903319 (1975-09-01), El-Mohamad
patent: 4125642 (1978-11-01), Petit et al.

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