Passivation of metal in metal/polyimide structures

Coating processes – With post-treatment of coating or coating material – Plural film forming coatings wherein one coating contains a...

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357 8, 357 52, 427379, 427387, 4273882, 427409, 437235, 437243, B05D 302

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051147548

ABSTRACT:
Disclosed is a process for passivating a metal surface in a metal/polyimide structure, such as a polyimide layer on a semiconductor substrate containing a pattern of metallization. The process invovles the formation of an intermediate layer of a silsesquioxane polymer between the polyimide layer and the substrate. The silsesquioxane layer passivates the metal, to inhibit interaction between the metal surface and the polyimide precursor material used in forming the polyimide, to provide a moisture-resistant and oxidation-resistant interface.

REFERENCES:
patent: 276597 (1888-11-01), Clodgo et al.
patent: 494006 (1890-03-01), Linde et al.
patent: 604702 (1890-10-01), Linde et al.
patent: 3179614 (1965-04-01), Edwards
patent: 3264250 (1966-08-01), Gall
patent: 4152195 (1979-05-01), Bahrle et al.
patent: 4423547 (1984-01-01), Farrar et al.
patent: 4529618 (1985-07-01), Ponjee et al.
patent: 4590258 (1986-05-01), Linde et al.
patent: 4612210 (1986-09-01), Hofer et al.
patent: 4626556 (1986-12-01), Nozue et al.
patent: 4723978 (1988-02-01), Clodgo et al.
patent: 4753827 (1988-06-01), Yoldas et al.
patent: 4778727 (1988-10-01), Tesoro et al.
patent: 4797307 (1989-01-01), Kunimoto et al.
Kim, et al., "Adhesion And Interface Studies Between Copper And Polyimide", J. Adhesion Sci. Tech., vol. 1, No. 4 (1987), pp. 331-339.
"Improved Metallurgy For Wiring Very Large Scale Integrated Circuits", International Technology Disclosures, vol. 4, No. 9 (Sep. 1986).

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