Passivation for integrated circuit structures

Fishing – trapping – and vermin destroying

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437 52, 437195, H01L 21425, H01L 21441

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active

050100246

ABSTRACT:
A method is described for producing an integrated circuit structure, including EPROMS, having excellent resistance to penetration by moisture and ion contaminants and a substantial absence of voids in an underlying metal layer in the structure, and, in the case of EPROMS, maintaining sufficient UV light transmissity to permit erasure which comprises stress relieving the underlying metal layer from stresses induced by the compressive stress of a silicon nitride encapsulating layer to inhibit the formation of voids therein by implanting the metal layer with ions to change the grain structure adjacent the surface of the metal layer; forming an insulating intermediate layer between said the layer and the silicon nitride layer selected from the class consisting of an oxide of silicon and silicon oxynitride having a compressive/tensile stress which sufficiently compensates for the compressive stress of the silicon nitride layer; and controlling the compressive stress in the silicon nitride layer to provide resistance to moisture and ion penetration superior to silicon dioxide or silicon oxynitride layers of similar thickness while inhibiting formation of voids in the metal layer.

REFERENCES:
patent: 3660819 (1972-05-01), Frohman-Bentchkowsky
patent: 4203158 (1980-05-01), Frohman-Bentchkowsky
patent: 4223048 (1980-09-01), Engle, Jr.
patent: 4393479 (1983-07-01), Du et al.
patent: 4406053 (1983-09-01), Takasaki et al.
patent: 4446194 (1984-05-01), Candelaria
patent: 4448400 (1984-05-01), Harari
patent: 4516313 (1985-05-01), Turi et al.
patent: 4532022 (1985-07-01), Takasaki
patent: 4618541 (1986-10-01), Forouhi
Samuelson, G. M. et al., "The Correlations Between Physical and Electrical Properties of PECVO SiN with their Composition Ratios", Journal of the Electrochemical Society: Solid State Science and Technology, vol. 129, No. 8, Aug. 1982, pp. 1773-1778.
Alexander, K. et al., "Moisture Resistive, UV Transmissive Passivation for Plastic Encapsulated EPROM Devices", IEEE 22nd Annual proceedings of the International Reliability Physics Symposium, Apr. 3-5, 1984, pp. 218-222.
"Controlling Stress in Oxy-Nitride Films", ASM America News Letter, vol. 1, No. 2, Dec. 1985, pp. 1-3.
Sinha, A. K. et al., "Reactive Plasma Deposited SiN Films for MOS-LSI Passivation", Journal of the Electrochemical Society: Solid State Science and Technology, vol. 125, No. 4, Apr. 1978, pp. 601-608.
Yue, J. T. et al., "Stress Induced Voids in Aluminum Interconnects During IC Processing", IEEE 23rd International Reliability Physics Symposium, 1985, pp. 126-137.
Frohman-Bentchkowsky, D., "FAMOS-A New Semiconductor Charge Storage Device", Solid State Electronics, vol. 17, 1974, pp. 517-529.
Katznelson, R. et al., "An Erase Model for FAMOS EPROM Devices", IEEE Transactions on Electron Devices, vol. ED-27, No. 9, Sep. 1980, pp. 1744-1752.
Nagy, T. E. et al., "Physical and Electrical Properties of Plasma Deposited Silicon Nitride Films", ECS Proceedings of the Symposium on Silicon Nitride Thin Insulating Films, vol. 83-8, 1983, pp. 167-176.
Rand, M. J. et al., "Optical Absorption as a Control Test for Plasma Silicon Nitride Deposition", Journal of the Electrochemical Society: Solid-State and Technology, vol. 125, No. 1, Jan., 1978, pp. 99-101.

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