Passivated and encapsulated semiconductors and method of making

Details Passivated and encapsulated semiconductors and method of making Passivated and encapsulated semiconductors and method of making

1975-08-14

1976-12-07

Wojciechowicz, Edward J.

357 71, 357 73, 357 74, H01L 2328, H01L 2348, H01L 2330, H01L 2302

Patent

active

039966020

ABSTRACT:
A semiconductor assembly having a semiconductor and conductive lead members secured thereto by conductive metal contact members is passivated by a layer of fused particles of non-conductive glass and encapsulated in a layer of non-conductive plastic. The product combines the best characteristics of a glass passivated semiconductor and a plastic encapsulated semiconductor while avoiding the disadvantages of both.

REFERENCES:
patent: 3844029 (1974-10-01), Dibugnara
patent: 3913127 (1975-10-01), Suzuki et al.

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