Pass through mode for multi-chip-module die

Details Pass through mode for multi-chip-module die Pass through mode for multi-chip-module die

1996-04-26

1997-04-29

Canney, Vincent P.

Excavating

G06F 1100

Patent

active

056256310

ABSTRACT:
A multi-chip-module (MCM) architecture allows direct access to a chip with minimum cost in space, yield, and signal delay. A first chip of the MCM is connected to a second chip via corresponding I/Os, but only the first chip has I/Os are directly accessible off the MCM. A coupling circuit, responsive to a control signal, which passes signals in the directly accessible I/Os of the first chip to the I/Os of the second chip.

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