Registers – Records – Conductive
Patent
1996-12-05
1999-10-12
Hajec, Donald
Registers
Records
Conductive
257679, 257783, 902 25, 902 26, 235488, 156295, G06K 1902, H01L 2348
Patent
active
059658665
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a smart card. In such cards, a module including the semiconductor chip is permanently fixed in a cavity in the card. The card itself can be molded from a plastic as a single piece. Preferably, the plastic is molded so as to form the cavity for the semiconductor chip. Alternatively, the card can consist of multiple layers connected to one another by lamination. In this case, the cavity is cut into the card.
2. Description of the Prior Art
A module to be implanted in a smart card of this type is described in German Reference DE 37 23 547. The module is fixed in the cavity of the card by means of a heat adhesive layer. To activate the heat adhesive layer and establish the adhesive connection, the layer must be heated at least briefly to relatively high temperatures, in some cases up to 150.degree. C. To this end, the module is implanted in the card by means of a heat punch. It is disadvantageous, first of all, that the card experiences plastic deformation in the cavity region due to the heat. This detracts from the optical impression of the card surfaces, which bear high-quality printing. Secondly, it is difficult and expensive to find and duplicate the optimal parameters for the implantation process (temperature of heat punch, duration of heat, geometry of punch, etc.). Furthermore, a special problem arises in processing semiconductor chips of various sizes, because the heat absorbed by the chips and the heat conducted to the heat adhesive layer depends on the size of the semiconductor chip. Incorrectly set parameters thus result in poor adhesion. Under certain circumstances, the adhesion is so inadequate that the module can be removed from the card very easily. In addition, overheating the sensitive semiconductor module can impair its function.
Furthermore, it is known from German reference DE 42 29 639 to fix modules of this type in cards by means of instant adhesives based on cyanoacrylate. However, since such adhesives take only seconds to harden, they cannot be applied to one or both of the surfaces to be connected until immediately before the module and the card are put together. This requires an additional process step linked directly to the implantation step in terms of time (and thus in terms of space as well). When instant adhesives are used, it is therefore not possible to provide mass-produced modules with adhesive layers and then store them for days or weeks prior to the actual implantation process.
SUMMARY OF THE INVENTION
The object of the present invention is to provide a smart card, wherein the module can be implanted in the card simply and reliably and connected securely to the card in a permanent fashion, while the disadvantages described above are avoided.
Pursuant to this object, and others which will become apparent hereafter, one aspect of the present invention resides in a pass card comprised of a card body having a cavity therein, a module with a semiconductor chip implanted permanently in the cavity of the card body, and micro-encapsulated adhesive means for fixing the module in the card body.
In the smart card according to the invention, the module including the semiconductor chip is fixed in the card by means of a micro-encapsulated adhesive. To activate the adhesive process, the microcapsules containing the adhesive are ruptured by pressure. The module is implanted into the card with the help of a punch, whereupon the microcapsules containing the adhesive break (burst) and the adhesive process can be implemented without the use of heat.
As this is done, none of the aforementioned problems resulting from heat during the adhesive process are experienced.
For mass production, the finished modules (electrical contact surfaces, semiconductor chips, bonding wires between semiconductor chips and contact surfaces, encapsulant over semiconductor chips and bonding wires) are usually arranged in a substrate or an endless substrate strip. The modules to be implanted in the card are punched out of the substrate
REFERENCES:
patent: 4711026 (1987-12-01), Swiggett et al.
patent: 4841134 (1989-06-01), Hida et al.
patent: 4843225 (1989-06-01), Hoppe
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5005282 (1991-04-01), Rose
patent: 5013900 (1991-05-01), Hoppe
patent: 5057679 (1991-10-01), Audic et al.
patent: 5089880 (1992-02-01), Meyer et al.
patent: 5302456 (1994-04-01), Matsui
patent: 5317191 (1994-05-01), Abe
patent: 5438750 (1995-08-01), Venambre
patent: 5502108 (1996-03-01), Silver et al.
patent: 5598032 (1997-01-01), Fidalgo
patent: 5600180 (1997-02-01), Kusaka et al.
patent: 5721451 (1998-02-01), Settles et al.
patent: 5834755 (1998-11-01), Haghiri-Tehrani et al.
patent: 5888624 (1999-03-01), Haghiri et al.
Hajec Donald
Orga Kartensysteme GmbH
Rodriguez Douglas
LandOfFree
Pass card having a semiconductor chip module attached by a micro does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Pass card having a semiconductor chip module attached by a micro, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pass card having a semiconductor chip module attached by a micro will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-654984