Coating apparatus – Gas or vapor deposition – Multizone chamber
Patent
1995-10-27
1996-07-16
Bueker, Richard
Coating apparatus
Gas or vapor deposition
Multizone chamber
118715, 118724, 118725, 118726, 118728, 4272556, C23C 1600
Patent
active
055363199
ABSTRACT:
Chemical vapor deposition apparatus is provided for the quick and efficient deposition of Parylene AF4 onto silicon wafers in the production of semiconductor chips. The apparatus includes an atmospheric shroud which envelopes the entire apparatus, and further includes an inert gas source for providing an inert atmosphere within the shroud. The purpose of the shroud and inert atmosphere is to exclude oxygen from the deposition chamber during vacuum evacuation and the subsequent coating cycle, thus allowing the coating process to be carried out in a substantially oxygen free environment.
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Beach William F.
Olson Roger A.
Wary John
Bueker Richard
Specialty Coating Systems Inc.
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