Parylene deposition apparatus including a heated and cooled supp

Details Parylene deposition apparatus including a heated and cooled supp Parylene deposition apparatus including a heated and cooled supp

1995-10-27

1996-07-16

Bueker, Richard

Coating apparatus

Gas or vapor deposition

Multizone chamber

118715, 118724, 118725, 118726, 118728, 4272556, C23C 1600

Patent

active

055363229

ABSTRACT:
Chemical vapor deposition apparatus is provided for the quick and efficient deposition of Parylene AF4 onto silicon wafers in the production of semiconductor chips. The apparatus includes a heated and cooled platen for supporting the wafer in the deposition chamber and for controlling the temperature of the wafer during deposition procedures, and further includes an electrostatic clamping device for clamping the wafer in intimate thermal contact with the platen.

REFERENCES:
patent: 3246627 (1966-04-01), Loeb
patent: 4495889 (1985-01-01), Riley
patent: 4683143 (1987-07-01), Riley
patent: 4945856 (1990-08-01), Stewart

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