Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-07-28
2000-11-07
Gaffin, Jeffrey
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361749, 361751, 361771, 361783, 174254, 174259, 174260, 257778, 257783, 438118, 438119, 29832, H05K 118
Patent
active
061445584
ABSTRACT:
A present invention is to provide a thin parts installation structure and their manufacturing method. There is provided a circuit on a wiring substrate, an adhesive is painted to a selected part installation position on the wiring substrate, a conductive adhesive is painted in a position where the terminal area of electronic parts contact the wiring pattern circuits. The electronic part is put in the selected position of wiring the substrate such that the terminals of the electronic parts contact the conductive adhesive prior to curing the adhesives, and followed by both the non-conductive adhesive and conductive adhesive are stiffened.
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Obara Rikuro
Shiota Naohiro
Gaffin Jeffrey
Minebea Co. Ltd.
Vigushin John B.
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