Particle size distribution for controlling flow of metal powders

Details Particle size distribution for controlling flow of metal powders Particle size distribution for controlling flow of metal powders

1994-06-30

1995-04-04

Wyszomierski, George

Specialized metallurgical processes, compositions for use therei

Compositions

Loose particulate mixture containing metal particles

420469, 428901, C22C 108, C22C 900

Patent

active

054033764

ABSTRACT:
Electrical conductors on printed circuit board substrates are made from metal particles having a particular particle size range distribution used to control the flow of molten metal when entering the liquid phase such as during fusing. The distribution can follow a bimodal curve wherein the mixture contains approximately 45% by weight of large copper particles between 44-74 microns, 45% by weight of small copper particles less than 5 microns in size with the remaining 10% by weight being particles with sizes between the smaller and larger sizes.

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