Particle-removing wafer

Details Particle-removing wafer Particle-removing wafer

2007-01-30

2007-01-30

Zacharia, Ramsey (Department: 1773)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S422000, C428S704000

Reexamination Certificate

active

10788756

ABSTRACT:
A particle-removing wafer is disclosed which is suitable for removing particles from a wafer support surface such as a wafer chuck used to support semiconductor wafers during the testing of IC devices on the wafers, for example. The particle-removing wafer includes a support body on which is provided a particle-adherent layer having a particle-adherent surface to which particles adhere when the particle-adherent surface is placed into contact with the particles. Consequently, upon subsequent placement of a production wafer on the wafer chuck, particles which may otherwise induce cracking of the wafer are no longer present on the chuck.

REFERENCES:
patent: 6010916 (2000-01-01), Horton et al.
patent: 6159773 (2000-12-01), Lin
patent: 11329327 (1999-11-01), None

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