Particle removal wafer

Details Particle removal wafer Particle removal wafer

1996-04-10

1998-06-09

Loney, Donald

Gas separation: processes

Liquid contacting

On surface extending mass

95237, 55282, B01D 4714

Patent

active

057626880

ABSTRACT:
A particle removal wafer including ridges defining recessed areas and sticky material placed in these recessed areas can be run through wafer processing equipment. The particle removal wafer can remove particles that would otherwise adhere to the backs of wafers run through this equipment. Particles adhering to the backs of wafers are a problem in the photolithographic steps. These particles cause the focus of the photolithographic system to be off and thus can cause fatal errors. By removing the particles which could adhere to the backs of wafers from the wafer fabrication equipment, the accuracy of the photolithographic process can be improved.

REFERENCES:
patent: 5344693 (1994-09-01), Sanders

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