Particle removal method and composition

Details Particle removal method and composition Particle removal method and composition

2008-02-07

2011-12-13

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

C510S175000

Reexamination Certificate

active

08075697

ABSTRACT:
A method and cleaning solution for cleaning electronic substrates, such as a semiconductor wafers, hard disks, photomasks or imprint molds. The method comprises the steps of contacting a surface of the substrate with a cleaning solution comprised of a polyphosphate, and then removing the cleaning solution from the surface. Additional optional steps include applying acoustic energy to the cleaning solution while the cleaning solution is in contact with the surface, and removing the cleaning solution from the surface by rinsing the surface with a rinsing solution with or without the application of acoustic energy. The cleaning solution comprises a polyphosphate, such as any of the water soluble polyphosphates. Depending on the application, the cleaning solution may also comprise a base and/or a quantity of suspended particles. Complexing agents, amines, biocides, surfactants and/or other substances, may also be added to the cleaning solution.

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