Particle removal cleaning method and composition

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

Reexamination Certificate

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C134S038000, C134S039000, C134S041000, C134S042000, C510S165000, C510S166000, C510S167000, C510S168000, C510S170000, C510S175000, C510S423000, C510S434000, C510S476000, C510S499000, C510S504000

Reexamination Certificate

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07959739

ABSTRACT:
A cleaning solution and method for removing submicron particles from the surface and/or the bevel of an electronic substrate such as a hard disk media substrate, or an imprint mold used in the manufacturing of the hard disk media or a read/write head assembly part. The cleaning solution comprises a polycarboxylate polymer or an ethoxylated polyamine. The method comprises the step of contacting a surface of the substrate with a cleaning solution comprised of a polycarboxylate polymer or an ethoxylated polyamine. Additional optional steps in the method include applying acoustic energy to the cleaning solution and/or rinsing the surface with a rinsing solution with or without the application of acoustic energy to the rinsing solution.

REFERENCES:
patent: 2002/0072482 (2002-06-01), Sachdev et al.
patent: 2002/0189635 (2002-12-01), Bodet et al.
patent: 2003/0144163 (2003-07-01), Morinaga et al.
patent: 2009/0056744 (2009-03-01), Carswell

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