Particle-free microchip processing

Coating apparatus – Gas or vapor deposition – With treating means

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118723R, 118725, C23C 1600

Patent

active

055229336

ABSTRACT:
Method and apparatus for reducing particulate contamination in microchip processing are disclosed. The method and apparatus comprise means to reduce particle velocity toward the wafer before the particles can be deposited on the wafer surface. A reactor using electric fields to reduce particle velocity and prevent particulate contamination is disclosed. A reactor using a porous showerhead to reduce particle velocities and prevent particulate contamination is disclosed.

REFERENCES:
patent: 3603284 (1971-09-01), Garnache
patent: 4962727 (1990-10-01), Harada
Compton, Chief Editor, "PECVD: A Versatile Technology," Semiconductor International, pp. 60-65, Jul. 1992.
Klavs, Jensen F., Einset, Erik O. and Fotiadis, Dimitrios I., "Flow Phenomena In Chemical Vapor Deposition of Thin Films," Annu. Rev. Fluid Mech., vol. 23, pp. 197-232, 1991.

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