Partially voided anti-pads

Details Partially voided anti-pads Partially voided anti-pads

2008-03-25

2008-03-25

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C361S792000, C029S846000, C029S847000

Reexamination Certificate

active

10621661

ABSTRACT:
A printed circuit board comprises a conductive layer and a via transecting the conductive layer. The printed circuit board comprises a pattern of conductive material having a plurality of voids in the conductive layer near the via.

REFERENCES:
patent: 5315069 (1994-05-01), Gebara
patent: 5828555 (1998-10-01), Itoh
patent: 5844146 (1998-12-01), Murray et al.
patent: 6235994 (2001-05-01), Chamberlin et al.
patent: 6329603 (2001-12-01), Japp et al.
patent: 6366466 (2002-04-01), Leddige et al.
patent: 6501181 (2002-12-01), Albinsson
patent: 6538538 (2003-03-01), Hreish et al.
patent: 6555914 (2003-04-01), Thurairajaratnam et al.
patent: 6710258 (2004-03-01), Oggioni et al.
patent: 6716072 (2004-04-01), Downes
patent: 7141742 (2006-11-01), Barr et al.
patent: 2002/0130737 (2002-09-01), Hreish et al.
patent: 2004/0188135 (2004-09-01), Brodsky et al.
patent: 2 374 984 (2002-10-01), None
GB Search Report for Application No. GB0415346.6 mailed on Nov. 12, 2004 (3 pages).

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