Partially polymerized divinylsiloxane linked bisbenzocyclobutene

Details Partially polymerized divinylsiloxane linked bisbenzocyclobutene Partially polymerized divinylsiloxane linked bisbenzocyclobutene

1994-04-14

1998-12-29

Codd, Bernard P.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

526281, 528 32, 556453, C08F 246, C08F 1008, C08G 7720

Patent

active

058543023

ABSTRACT:
A process for forming a partially polymerized DVS resin comprising heating DVS monomer disiloxane) in a solvent at a concentration of DVS monomer in the solvent such that:

REFERENCES:
patent: 2852379 (1958-09-01), Hepher et al.
patent: 3075950 (1963-01-01), Newland et al.
patent: 3625919 (1971-12-01), Kamogawa et al.
patent: 3948667 (1976-04-01), Ichikawa et al.
patent: 4197133 (1980-04-01), Zweifel et al.
patent: 4354976 (1982-10-01), Romer
patent: 4469778 (1984-09-01), Iwayanagi et al.
patent: 4525523 (1985-06-01), Nakamura et al.
patent: 4540763 (1985-09-01), Kirchhoff
patent: 4571375 (1986-02-01), Benedikt
patent: 4642329 (1987-02-01), Kirchhoff et al.
patent: 4783514 (1988-11-01), Kirchhoff et al.
patent: 4812588 (1989-03-01), Schrock
patent: 5002808 (1991-03-01), Hahn
patent: 5416233 (1995-05-01), DeVries et al.
Kilb, Journal of Physical Chemistry, 62, 1958, pp. 959-971.
Price et al., Journal of Physical Chemistry, 62, 1958, pp. 972-978.
Price, Journal of Physical Chemistry, 62, 1958, pp. 977-978.
Zimm et al., Journal of Physical Chemistry, 62, 1958, p. 979.
Specht et al., Tetrahedron, vol. 38, No. 9, pp. 1203-1211 (1982).
Harris, Journal of Chemical Physics, vol. 23, No. 8, pp. 1518-1525 (Aug. 1955).
Hoeve, Journal of Polymer Science, vol. XXI, pp. 11-18 (1956).
Johnson et al., IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. 13, No. 2, Jun. 1990, pp. 347-352.
Radik et al., "MCM-D Technology For A Communication Application," 1993 ICEMM, Denver, CO, Apr. 13-15, 1994.
Shimoto et al., "Cu/Photosensitive-BCB Thin Film Multilayer Technology for High Performance Multichip Modules," 1994 ICEMM, Denver, CO, Apr. 13-15, 1994.
Moyer et al., "Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronic Applications. III. 1 To 20 Micron Patterned Films," Proceedings MRS; 1993.
Moyer et al., "Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronic Applications: Part II," Proceedings IEPS, Austin, 1992.
Rutter et al., "A Photodefinable Benzocyclobutene Resin for Thin Film Microelectronic Applications," Proceedings of 1st Int'l Conf. on Multichip Modules, ISHM/IEPS, Denver, CO, Apr. 1992.
Research Disclosure No. 339, Jul. 1992, Article No. 33987, "Low Stress Curing of DVS", pp. 585, 586, the whole article.

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