Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-12-20
2001-11-27
Gaffin, Jeffrey (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S800000, C361S818000, C361S796000, C174S034000
Reexamination Certificate
active
06324075
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to computer systems. More specifically, the invention relates to a partially covered motherboard having improved EMI and thermal characteristics.
BACKGROUND OF THE INVENTION
As personal computer components become more complex and powerful, they generate more heat and stronger electric fields. That heat must be effectively dissipated to prevent damage to the system. Those electric fields can cause electromagnetic interference (“EMI”) that must be contained to prevent undesirable interference with other electronic equipment and to comply with various regulations—in particular, FCC imposed “open box” field strength limits.
A combination of various heat dissipation devices (e.g., heat sinks and heat spreaders) and forced convection apparatus (e.g., one of more fans) is conventionally used, when addressing the thermal issue. EMI containment is often handled by housing certain components in various types of metal casings, accompanied by appropriate gaskets and/or grounding mechanisms, and by using EMI emission absorbing chassis openings.
Current designs use many discrete components to manage EMI emission and heat dissipation, which may drive up system cost. In addition, many designs require throttled operation to keep EMI/heat generation from exceeding maximum thresholds, which degrades system performance.
Accordingly, there is a need for an improved assembly for a computer that provides a low cost integrated EMI/thermal management solution. There is a need for such an assembly that enables the system to operate at full power. The present invention provides such an assembly.
SUMMARY OF THE INVENTION
An improved assembly for a computer is disclosed. That assembly includes a motherboard having a first side and a second side. The first side has a first portion and a second portion. The first portion contains components capable of generating substantial heat and a strong electric field. The assembly further includes an EMI attenuating cover that encloses the first portion of the first side of the motherboard, but does not enclose the second portion of the first side of the motherboard.
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patent: 5224019 (1993-06-01), Wong et al.
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patent: 6018125 (2000-01-01), Collins et al.
patent: 6058022 (2000-05-01), Gianni et al.
Egger Ron D.
Hanes Chris H.
Le Minh T.
Unrein Edgar J.
Dinh Tuan
Gaffin Jeffrey
Intel Corporation
Seeley Mark V.
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