Part holder and electronic equipment using same

Details Part holder and electronic equipment using same Part holder and electronic equipment using same

1999-07-29

2001-12-04

Gaffin, Jeffrey (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S050510, C174S13800J, C174S250000, C361S760000, C361S807000, C361S809000

Reexamination Certificate

active

06326558

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to part holders and printed circuit boards and, more particularly, to a part holder to insert and hold a leadless part in a hole formed, for example, in a printed circuit board, and a printed circuit board using same.
2. Description of the Prior Art
It has been conventionally considered to use leadless parts in mounting on a printed circuit board because the use of leaded parts makes the process complicate.
Meanwhile, there are methods as prior arts to directly mount a substrate in a way different from the present method, as disclosed in Japanese Patent Laying-open No. S64-84787 [H05K 1/14] laid open to the public on Mar. 30, 1989, Japanese Utility Model Laying-open No. S63-136377 [H05K 1/14, 1/02, 7/14] laid open on Sep. 7, 1988, Japanese Utility Model Laying-open No. S61-134075 [H05K 1/14] laid open on Aug. 21, 1986, and Japanese Utility Model Laying-open No. S60-45465 [H05K 3/36, 1/14] laid open on Mar. 30, 1985.
However, if leadless parts are directly inserted in the holes formed in a printed circuit board, a problem is encountered that the leadless part cannot be fix in the hole due to variation in size of the holes. That is, if the leadless part is not fixed in the hole, the leadless part is positioned with inclination. This might cause disconnection of a pattern on the leadless part from a pattern on the printed circuit board, or floating of a leadless part upon dipping, resulting in poor soldering.
SUMMARY OF THE INVENTION
Therefore, it is a primary object of the present invention to provide a part holder which can fix a leadless part inserted in a hole formed in a printed circuit board.
It is another object of the present invention to provide a part holder which can positively solder between a leadless part and a printed circuit board by dipping. It is further object of the present invention to provide a printed circuit board having leadless parts soldered thereon by dipping.
A part holder according to the present invention is for inserting a leadless part in a hole formed in a printed circuit board, and comprises: a part holding portion for holding the leadless part; two legs integrated with the part holding portion and to be inserted in the hole; and a resilient portion formed between the two legs and urging the leadless part, in the hole, onto one surface of the hole.
The leadless part is held, for example, by the projection provided in the part holding portion of the part holder. The two legs of the part holder are inserted in a hole formed in a printed circuit board. At this time, because the resilient portion provided on the leg forces against an inner edge in one way, the part holderv is fixed in the hole.
According to the present invention, a part inserted in a hole can be positively fixed regardless of variation in size of holes formed in a printed circuit board or leadless part. Consequently, the both can be positively soldered by dipping.
In one aspect of the present invention, the part holding portion includes a receiving portion to receive one main surface of the leadless part, and an engaging portion to engage the leadless part received on the receiving portion. Thus, the leadless part can be fixedly held on the part holding portion.
In another aspect of the present invention, the leadless part has a support hole, and the part holding portion has a projection to be engaged with the support hole. If the leadless part is attached to the part holding portion such that the projection engages with the support hole, the leadless part is fixedly held on the holding portion.
In further aspect of the present invention, the leg includes a resilient piece to be abutted against an inner surface of the hole. Due to this, the part holder is fixed in the hole.
In one embodiment of the present invention, the resilient piece is a spring utilizing flexion of a resin forming mold.
In still another aspect of the present invention, the leg includes a removal preventing portion formed at a lower portion thereof. Due to this, if the part holder is once mounted on the printed circuit board, it will not be removed.
In another aspect of the present invention, a guard portion is formed at an upper end of the part holder. For example, during assembling the leadless part is prevented from being touched by a human hand.
If the above-structured part holder is mounted on the printed circuit board, a first pattern formed on one main surface of the leadless part is closely contacted with a second pattern formed on a backside of the printed circuit board. Because the part holder is structured not to cause positional deviation, the first pattern and the second pattern can be soldered to each other by dipping.
The above described objects and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.


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patent: 5251087 (1993-10-01), Sakashita et al.
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patent: 5920463 (1999-07-01), Thomas et al.
patent: 6013133 (2000-01-01), Takashima et al.
patent: 406260737 (1994-09-01), None
patent: 407212058 (1995-08-01), None

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