Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-07-27
1994-09-20
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29846, H05K 336
Patent
active
053477103
ABSTRACT:
Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitized flexible circuit. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication. The planar circuitization, as data lines, address lines, and control lines of a logic chip or a memory chip are on the individual printed circuit boards and cards, which are connected through the circuitized flex, and communicate with other layers of flex through Z-axis circuitization (vias and through holes) in the laminate.
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IBM Technical Disclosure Bulletin vol. 22 No. 9 Feb. 1980, p. 3988 by J. Funari et al.
Gall Thomas P.
Heck Howard L.
Kresge John S.
Arbes Carl J.
Goldman Richard M.
International Business Machines - Corporation
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