Parallel plate transmission lines integrated with coplanar waveg

Wave transmission lines and networks – Long lines – Strip type

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333247, 357 4, 29600, H01P 308

Patent

active

045757003

ABSTRACT:
A solid state integrated circuit type transmission line structure is formed by a semi-conductor substrate consisting of an active layer and a semi insulating layer of given conductivities and permittivity which bears a groove extending through the active layer into the semi insulating layer of the substrate. A thin metalization coating on the active layer surface of the substrate extends into the slot along opposite slot sides thereof, and a low loss dielectric material of different permittivity at least partially fills the slot and extends between the metalization coatings of the slot. There is thus formed a slot line structure and parallel plate transmission line. Vapor or sputter deposited metal particles obliquely impinge on the surface of the substrate bearing the groove in two stages via opposite inclinations to insure metalization deposit along both sidewalls of the slot integrated to the flat upper surface coating prior to filling of the slots and covering of the metalized surface with the loss dielectric material.

REFERENCES:
patent: 3891949 (1975-06-01), Marquardt et al.
patent: 3982271 (1976-09-01), Olivieri et al.
patent: 4379307 (1983-04-01), Soclof

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