Parallel multiwavelength optical subassembly

Optical waveguides – With optical coupler – Plural

Reexamination Certificate

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C385S114000

Reexamination Certificate

active

06937786

ABSTRACT:
A parallel optics and wavelength division multiplexing package for multiplexing optical data signals for transmission, or for receiving and demultiplexing optical data signals. The package includes an array of diodes mounted on a parallel transmitter or receiver circuit for receiving electrical signals from the circuit and converting them into an array of corresponding light signals, or for receiving an array of light signals and converting them into an array of corresponding electrical signals. In a transmitter package, an optical multiplexer, located adjacent the array of diodes, receives the array of light signals and converts them into a set of corresponding parallel multiplexed light signals. In a receiver package, an optical demultiplexer, located adjacent the array of diodes, receives a set of parallel multiplexed light signals and converts them into the array of demultiplexed light signals. A lid mounted on the optical multiplexer or demultiplexer includes alignment pins for aligning the multiplexer or demultiplexer with a parallel fiber ribbon for transmitting or receiving the light signals. The package can include an hermetic or non-hermetic enclosure, depending upon the materials used within the package.

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patent: 2003/0152113 (2003-08-01), Knopp
patent: 0 343 290 (1988-05-01), None
Ali, Mohammed E. et al. Demonstration of a High Density Parallel-WDM Optical Interconnect. Lasers and Electro-Optics Society. 2004. vol. 2, pp. 459-460.
Lemoff, Brian E. et al. Demonstration of a Compact Low-Power 250-Gb/s Parallel-WDM Optical Interconnect. Jan. 2005. Photonics Technology Letters. vol. 17, issue 1, pp. 220-222.
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Katsuki Suematsu; Masao Shinoda; Takashi Shigenaga; Jun Yamakawa; Masayoshi Tsukamoto; Yoshimi Ono and Takayuki Ando, Super Low-Loss, Super High-Density Multi-Fiber Optical Connectors, Furukawa Review No. 23, 2003, pp. 53-58.
Koichi Maeno; Takahiro Ueno; Masato Shiino; Yutaka Arai; Kazuhiro Takayama; Katsuki Suematsu; Masao Shinoda; Koichi Takagi; Hiroyuki Yamada and Kiyoshi Midorikawa, Development of Mini-MT Ferrule Using Short-Cycle Injection Molding, Furukawa Review, No. 19, 2000, pp. 143-148.
NGK Insulators; Application Note: Fiber Ribbon For Parallel Optical Interconnects; MTP is a registered trademark of US Conec, LTd, pp. 2.

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